Support

Dr Diebold’s group gratefully acknowledges support from:

Current Funding

  • TEL USA for Applications of Machine Learning to Materials Characterization, 2021 - 2024
  • Onto Innovations for Mueller Matrix Scatterometry Measurement of 3D DRAM structures fabricated with Si/SiGe multilayers, Summer 2022 – 2024

Previous Funding

  • TEL Technology Center, USA for Advanced CMOS Metrology, 2019-202
  • SRC for Determining the Sensitivity of Metrology to Changes in Multi-Nanowire and Multi-Nanosheet FETs, 2017-2019
  • NERC – INDEX for Aberration-Corrected Microscopy and Non-Linear Spectroscopy for Nanoscale Metrology (2008 – 2012) Graphene Integration (2013 – 2017)
  • Nanometrics Incorporated for Metrology of Nanostructures using Mueller Matrix Polarimetry
  • SRC for Advanced Linear and Non-Linear Optical CD Metrology
  • New York Center for National Competitiveness in Nanoscale Characterization – for Metrology for and determination of properties of new materials and structures
  • KLA-Tencor for Advanced Optical Measurements
  • SEMATECH for Advanced CMOS Metrology
  • SEMATECH 3D Interconnect for Advanced TSV Microscopy

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