SUNY Digital Repository: Modeling the copper microstructure and elastic anisotropy and studying its impact on reliability in nanoscale interconnects

SUNY Digital Repository: Modeling the copper microstructure and elastic anisotropy and studying its impact on reliability in nanoscale interconnects

Published:
Thursday, April 27, 2017 - 15:40
In the News
SUNY Poly Faculty in the News
Research News
James Lloyd

SUNY Digital Repository

Copper is the primary metal used in integrated circuit manufacturing of today. Even though copper is face centered cubic it has significant mechanical anisotropy depending on the crystallographic orientations.

Read More