SUNY Polytechnic Institute’s (SUNY Poly) Applied Electromagnetics and RF Circuits (AE&RFC) Research Center, led by Dean of the College of Engineering Dr. Abdullah Eroglu as principal investigator, is working on a groundbreaking semiconductor inspection technology designed to improve manufacturing reliability, reduce material waste, and strengthen domestic microelectronics production through a new partnership with New York-based technology company Xallent. Supported by a $60,000 grant managed by The Research Foundation for SUNY from FuzeHub’s New York State Microelectronics Innovation Challenge, the project focuses on developing a non-contact, non-destructive semiconductor inspection platform using terahertz (THz) radiation. 

The initiative addresses one of the semiconductor industry’s most significant manufacturing challenges: identifying microscopic defects and inconsistencies in advanced semiconductor materials before they lead to device failures, production delays, or costly wafer losses. As semiconductor manufacturers increasingly adopt advanced materials such as silicon carbide (SiC) and gallium nitride (GaN) for use in electric vehicles, aerospace systems, radar, telecommunications, and defense technologies, the need for faster, more precise inspection methods has become critical. 

Unlike conventional inspection systems that rely on physical electrical probes, SUNY Poly’s technology uses safe, non-ionizing terahertz electromagnetic waves to inspect wafers without direct contact. Traditional probe-based testing methods can damage fragile semiconductor surfaces and delicate thin films, particularly after chemical mechanical polishing (CMP), where even slight surface disruption can compromise performance or render components unusable. The new THz-based platform eliminates that risk while enabling deeper inspection beneath the wafer surface. 

Using advanced terahertz time-domain spectroscopy (THz-TDS), researchers at SUNY Poly’s AE&RFC Research Center will generate wafer-scale maps that measure electrical conductivity, film thickness, and structural uniformity, while also detecting buried voids, delamination, and interfacial contamination that are difficult to identify with conventional optical inspection technologies. The system is intended to provide semiconductor manufacturers with real-time quality-control data that can improve production yields, accelerate process optimization, and reduce scrap during fabrication. 

The collaboration with Xallent is central to transitioning the technology from laboratory research into a manufacturing-ready solution. While SUNY Poly researchers contribute expertise in terahertz measurements, electromagnetic modeling, and advanced semiconductor characterization, Xallent provides automation engineering, precision motion-control systems, and manufacturing workflow integration for implementation in semiconductor fabrication environments. Together, the partners aim to create an inspection platform that integrates directly into existing semiconductor manufacturing processes. 

“This project represents an important step toward creating faster, safer, and more reliable semiconductor inspection technologies that can directly support the future of advanced electronics manufacturing,” said Dr. Eroglu. “By combining SUNY Poly’s expertise in terahertz systems and electromagnetic characterization with Xallent’s strengths in automation and manufacturing integration, we are developing a solution that has the potential to improve semiconductor quality, reduce waste, and strengthen domestic microelectronics capabilities.”

“Partnering with SUNY Poly and securing the support of FuzeHub marks a pivotal milestone in our mission to solve the semiconductor industry’s most critical testing bottlenecks,” said Dr. Kwame Amponsah, CEO of Xallent. By embedding this advanced, non-contact terahertz metrology directly into our Heterogeneous Integration Test System (HITS™), we are delivering a first-of-its-kind hybrid platform that combines rapid non-destructive screening with ultra-fine physical diagnostics.

“As the industry accelerates toward complex 2.5D and 3D packaging for AI and high-performance computing, the risk of mechanical damage during inspection becomes a multi-million-dollar liability,” Amponsah continued. “This breakthrough allows manufacturers to aggressively scale their yield and confidently verify a 'Known-Good Die' without ever compromising the physical or electrical integrity of next-generation architectures. We are pleased to advance this vital innovation right here in New York’s thriving microelectronics ecosystem to strengthen the global supply chain.”

Over the next 12 months, the research team will focus on integrating automated wafer scanning, calibration standards, advanced signal-processing algorithms, and defect-detection capabilities into the platform. Planned deliverables include wafer-scale conductivity and thickness mapping, automated defect analysis tools, and statistical process-control outputs compatible with semiconductor manufacturing quality systems. 

The project also aligns with New York State’s rapidly growing semiconductor ecosystem and broader national priorities tied to domestic microelectronics production and supply chain resilience. By helping manufacturers detect defects earlier, reduce material losses, and improve reliability in advanced semiconductor devices, the SUNY Poly-Xallent collaboration could have long-term impacts across industries ranging from consumer electronics and electric vehicles to aerospace and national defense.