Clarkson University The 20th International Symposium on Chemical-Mechanical Planarization was jointly hosted by Clarkson University’s Center for Advanced Materials Processing (CAMP) and the CMP Users Group of North America, this summer in Lake Placid, N.Y.

Speakers included engineers and scientists from IBM, Globalfoundries, Samsung, Ebara, Entegris, Cabot Microelectronics, Ferro, Fujimi Corporation, Hitachi Chemical Company, IMEC in Belgium and others. University speakers were from Kyushu Institute of Technology, Tokyo Institute of Technology, Shizuoka University, Yamanashi University, National Taiwan University of Science and Technology, Hebei University of Technology, Ozyegin University, Clarkson University, Bradley University, SUNY Polytechnic Institute and more.

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