Professional Background

• ON Semiconductor, East Greenwich, RI
  • Device Engineer - Yield Enhancement Investigate yield issues using KLA inspection and defect review toolset (2122/4200C/SP1) and FEI 600XL FIB.
  • Failure Analysis Engineer - Primary Investigator of customer returned ICs using non-destructive and destructive analysis techniques including X-Ray, Optical, Scanning Acoustic microscopy and Photon Emissions Microscopy, Manual Probe stations, Wet and Plasma etch chemistries, SEM/EDS and Focused Ion Beam analysis. Other duties included assisting Design Engineering teams with FIB circuit modifications.
• United Technologies - Otis Elevator Company, Farmington, CT
  • Failure Analysis Technician - Responsible for the set-up of the Electrical Test Qualification Center (ETQC) and failure analysis laboratory.
• Allegro Microsystems - Worcester, MA
  • Failure Analysis Technician - Developed technique for electrical probing of plastic encapsulated ICs with polyimide passivation and ILD layers.
• United States Air Force
  • Integrated Avionics Electronic Warfare Equipment and Component Specialist
    Received Medal of Acheivement for excellence in troubleshooting and maintenance of various EW equipment systems.

Education

• B.Sc. (Industrial Technology), Southern Illinois University

Responsibilities

• Recipe creation/management for CNSE JDP projects for all CSR/INVENT metrology tools
• Engineering team member for SEMATECH EUV, FEP and 3D Interconnect research projects.
• Provide KLARITY defect analysis support for CNSE and its customers.
• Act as liaison between CNSE engineering and CNSE metrology faculty members.

Key Accomplishments

• Created TEM lamella showing CNSE's ability to create 5.3nm FIN structures.
• Enabled front surface TXRF process monitoring in CNSE's Center for Semiconductor Research.