The American Institute for Manufacturing Integrated Photonics (AIM Photonics) and Analog Photonics (AP) has announced the release of the AP SUNY Process Design Kit v2.0a (APSUNY_PDKv2.0a).

In this release, Analog Photonics (AP) expanded the set of Silicon Photonics Integrated Circuit (PIC) component libraries within SUNY Poly’s process to address the high-speed optical communication needs. Combined with Multi-Project Wafer (MPW) runs, this PDK will give AIM Photonics’ members access to world-class silicon photonics components for the development of 100G, 200G and 400G+ optical transceivers or systems used in data centres, metro and long haul optical networks.

AIM CEO and SUNY Poly Vice President for Research Michael Liehr said: “AIM Photonics is laying a strong foundation for enabling next-generation photonics-based capabilities, and we anticipate that this latest PDK version will provide even further incentive for members of the photonics industry to collaborate with AIM Photonics to leverage the updated PDK, especially for high-speed communications technologies, and join the more than 80 signed members and additional interested collaborators from across the United States, including industrial, academic, and governmental members who have found incredible value in this growing national initiative."

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