Background:

Integrated circuits are built of many layers. Each layer must be perfectly flat so that connections line up between layers and electricity flows properly throughout. Conventional CMP systems consist of three main components: 1. a polishing pad, 2. the polishing slurry, and 3. the surface to be polished (e.g., wafer or optical lens). Manufacturers currently achieve flatness or planarization through a conventional two-step process. The first step coarsely planes the surface using large abrasive particles suspended in a liquid slurry to provide a high removal rate of the desired material, which leaves a rough surface with many grooves or scratches etched by the large particles. The second step polishes the surface using smaller particles and slower rates of abrasion for a fine finish. The slurry must be changed between steps, costing manufacturing time and expense.

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