Read Chris Borst's Nanotechnology Now Article: Advancing Nanoscience through R&D Consortia 

Professional Background

• Associate Vice President for 300mm Technical Operations, CNSE, SUNY Polytechnic Institute, 2017-present
• Associate Vice President for 450mm Technical Operations, CNSE, SUNY Polytechnic Institute, 2012-2017
• Assistant Vice President for Module Engineering, CNSE, University At Albany, 2008-2012
• Process Engineering Manager, CNSE, University at Albany, 2007-2008
• Program Manager - Center for Semiconductor Research, CNSE, University at Albany, 2006-2007
• Member of Technical Staff, Texas Instruments SiTD, 2001-2006

Education

• PhD - Chemical Engineering, Rensselaer Polytechnic Institute, Troy, NY 2000
• BS - Chemical Engineering, University of Virginia, Charlottesville, VA 1996

Technical Program Management Responsibilities

• Provide executive leadership and direction to CNSE's 300mm line operations in the Center for Semiconductor Research (CSR) including WIP management, cycle time metrics, tool utilization, and manufacturing process yields.
• Meet regularly with the Program Managers of CNSE's internal strategic programs to achieve key program deliverables.
• Create a collaborative environment within Operations and other CNSE departments; and across strategic partners.  Direct multiple CNSE teams to achieve the organization's strategic goals.
• Monitor and control key operational metrics, and communicate with the site-wide executive management. Develop and execute strategies to continuously improve production metrics.

Research Interests
Advanced CMOS processing, integration, and simulation; semiconductor equipment and process control; electronic materials and processing; planarization processing

Awards

• Albany Business Review 40 under 40 recipient, 2015
• SRC Graduate Fellowship, 1997-2000

Professional Memberships/Organizations

• Co-chairman, Materials Research Society (MRS) Spring 2013 Conference Symposium BB
• Co-chairman, Materials Research Society (MRS) Spring 2010 Conference Symposium E
• Co-chairman, Materials Research Society (MRS) Spring 2007 Conference Symposium C
• Executive Committee, IMIC CMP-MIC 2006
• Advisory Committee, SRC ERC Planarization Research Tasks 2005-present
• Peer-reviewer for Thin Solid Films, Journal of the Electrochemical Society, IEEE Transactions on Semiconductor Manufacturing, and The ASME Journal of Manufacturing Science and Engineering

Patents

6,693,357 - Methods and Semiconductor Devices with Wiring Layer Fill Structures to Improve Planarization Uniformity

6,776,688 - Real-time Polishing Pad Stiffness Control Using Magnetically Controllable Fluid

7,268,073 - Post-polish Treatment for Inhibiting Copper Corrosion

Books

C. L. Borst, W. N. Gill, and R. J. Gutmann, CMP of Low-k Polymers and Organosilicate Glasses: Fundamental Mechanisms and Application to IC Interconnect Technology, Boston: Kluwer Academic Publishers (2002)

Refereed Publications

T. Michalak, J. Herman, A. Basavalingappa, M. Rodgers, D. Franca, C. Borst, "Study of millisecond laser annealing on recrystallization, activation, and mobility of laser annealed SOI doped via arsenic ion implantation," Journal of Vacuum Science & Technology B, vol.33, no.1, pp.011201-9 (2015) 

R.-H. Baek, T.-W. Kim, T. Michalak, C. Borst, CS. Shin, WK. Park, S. C. Song, Geoffrey Yeap, R. Hill, C. Hobbs, W. Maszara, D.-H. Kim, and P. Kirsch, ìElectrostatics and Performance Benchmarking using all types of III-V Multi-gate FinFETs for sub 7nm Technology Node Logic Applicationî, VLSI (2014)

R.T.P. Lee, R.J.W Hill, W.-Y. Loh, R.-H. Baek, S. Deora, K. Matthews, C. Huffman, K. Majumdar, T. Michalak, C. Borst, P.Y. Hung, C.-H. Chen, J.-H. Yum, T.-W. Kim, C.Y. Kang, Wei-E Wang, D.-H. Kim, C. Hobbs, P.D. Kirsch, "VLSI processed InGaAs on Si MOSFETs with thermally stable, self-aligned Ni-InGaAs contacts achieving: Enhanced drive current and pathway towards a unified contact module," Electron Devices Meeting (IEDM), 2013 IEEE International, Dec 9-11, 2013

T. Michalak, J. Herman, M. Rodgers, D. Franca, C. Borst, ìSimulation of Millisecond Laser Anneal on SOI: A Study of Dopant Activation and Mobility and its Application to Scaled FinFET Thermal Processing,î Materials Research Society Symposium Proceedings 2013, Apr 1-5, 2013,

R.-H. Baek, C. Y. Kang, A. Kumar, C.-W. Sohn, T. Michalak, C. Borst, C. Hobbs, P. Kirsch, R. Jammy, ìComprehensive Study of Process-Induced Device & Circuit Performance Variability and its Optimization for 14 nm Technology Node Bulk FinFETsî, VLSI (2012)
 
T. Park, T. Tugbawa, D. Boning, C. Chidambaram, C. Borst, and G. Shinn, "Chip-Scale Modeling of Electroplated Copper Surface Profiles", J. Electrochem. Soc. 151(6), C418 (2004)
 
M. Eissa, D. Ramappa, E. Ogawa, E. Zielinski, C. Borst, G. Shinn, and A. McKerrow, "Defect Reduction Challenges in the Integration of Copper CMP for 90nm Technology" 21st Proceedings of the Advanced Metallization Conference, San Diego, CA, October (2004)
 
C. L. Borst, S. Smith, and M. Eissa "Challenges and Rewards of Low-abrasive Copper CMP: Evaluation and Integration for Single-Damascene Cu/Low-k Interconnects for the 90nm Node" Proceedings of the Materials Research Society 816, 3 (2004)
 
C. L. Borst, D. G. Thakurta, W. N. Gill, and R. J. Gutmann, "Chemical-mechanical Planarization of Low-k Polymers for Advanced IC Structures" Transactions of the ASME, Jrnl. Of Electronic Packaging 124(4), (2002)
 
C. L. Borst, D. G. Thakurta, W. N. Gill, and R. J. Gutmann, "Surface Kinetics Model for SiLK Chemical Mechanical Polishing" J. Electrochem. Soc. 149(2), G118 (2002)
 
D. G. Thakurta, C. L. Borst, D. W. Schwendeman, R. J. Gutmann, and W. N. Gill, "Three-Dimensional Chemical Mechanical Planarization Slurry Flow Model Based on Lubrication Theory" J. Electrochem. Soc. 148(4), G207 (2001)
 
C. L. Borst, V. Korthuis, G. B. Shinn, J. D. Luttmer, R. J. Gutmann, and W. N. Gill "Chemical-Mechanical Polishing of SiOC Organosilicate Glasses: The Effect of Film Carbon Content" Thin Solid Films 385, 281 (2001)
 
D. G. Thakurta, C. L. Borst, D. W. Schwendeman, R. J. Gutmann, and W. N. Gill, "Pad Porosity, Compressibility, and Slurry Delivery Effects in Chemical-Mechanical Planarization: Modeling and Experiments" Thin Solid Films 366, 181 (2000)
 
C. L. Borst, W. N. Gill, and R. J. Gutmann, "Chemical-Mechanical Planarization of BCB and SiLK Interlevel Dielectrics with Varied Cure Conditions in Copper Slurries" Int. Jrnl. Of Chemical-Mechanical Planarization for On-Chip Interconnection 1(1), 26 (2000)
 
C. L. Borst, D. G. Thakurta, W. N. Gill, and R. J. Gutmann, "Chemical-Mechanical Polishing Mechanisms of Low-k Polymers in Copper Slurries" J. Electrochem. Soc.146(11), 4309 (1999)
 
C. Borst, S. Grzegorczyk, S. Strand, and G. Carta, "Equilibrium and Mass Transfer of Amino Acids in Cationic Exchangers: Temperature Effects" Reactive and Functional Polymers 32, 25 (1997)

Conference Publications and Presentations

S. Kim, S. Dunn, S. Smith, W. Collision, J. Prudhomme, H-M. Wang, J. Maniscalco, N. Yathapu, C. Song, B. Wang, C. Carr, H-W. Liu, B. Gall, A. Alaestante, M-H. Chen, R. Conti, C. Yang, D. Sullivan, K. Culafi, B. Moon, Y-C. Lin, Y-L. Fu, K. Sieg, A-S. Larrea, N. Fish, R. Swaine, A. Bialy, M. Tallon, G. Stapf, J. Hagwood, M. Bryant, R. Cottle, S. Chang, M. Kelling, K. Schaefer, D. Franca, P. Lin, C. Borst, K. Lee, JH. Lim, D. Skilbred, CC Chien, F. Robertson, E. Fria, ì450mm Cu Single Damascene BEOL Process with 20nm Half-pitched Featuresî, Interconnect Technology Conference/Advanced Metallization Conference (IITC/AMC), pp.8-10 (2016)

C-W. Huang, C. Borst, ìEstimation of number of PGV for a 450mm fab: FA: Factory automationî, Proc. of 27th SEMI Advanced Semiconductor Manufacturing Conference (ASMC), pp. 164-167 (2016)

A-S. Larrea, S. Dunn, W. Collison, D. Franca, C. Borst, J. Lee, JH. Lim, S. Chang, ìSTI 28nm pitch guided DSA to enable the 450mm tools qualification and transitionî, Proc. of 27th SEMI Advanced Semiconductor Manufacturing Conference (ASMC), pp. 237-242 (2016)

F. Tolic, T. Burroughs, C. Borst, R. Hill, D. Penigelapati, J. Nalaskowski, S. PapaRao, ìInnovative Advanced Nanotechnology Test Mask for Chemical and Mechanical Planarization Process Predictionî, Proc. ICPT, Nov 18-20 (2014)

C. Borst, ìDriving Transistor Technology Sub-10nm: Process and Equipment Directionsî, SemiconWEST, July (2014)

A. Alaestante, C. Borst, ì450 mm Carrier Interoperability Effects on Particle Generationî, Proc. of 25th SEMI Advanced Semiconductor Manufacturing Conference (ASMC), May 19-21 (2014)

J. Lin, P. Lin, W-Y. Ku, M. Kelling, G. Akiki, S. Kwon, K. Lee, W. Collison, S. Chang, R. Cottle, Y-C. Wang, C. Borst, D. Skilbred, F. Robertson, P. Farrar, ìOpportunities and challenges of the 450mm transitionî, IEEE International Electron Devices Meeting (2013)

R.-H. Baek, C.Y. Kang, A. Kumar, C.-W. Sohn, T. Michalak, C. Borst, C. Hobbs, P. Kirsch, R. Jammy, ìComprehensive Study of Process-Induced Device Performance Variability and Optimization for 14 nm Technology Node Bulk FinFETs, Proceedings of SISPAD, Sept 5-7 (2012)

C. Borst, ìNanotechnology Process and Equipment Development Enabled by Consortia-based R&Dî, SemiconWEST, July (2012)

M. Liehr and C. Borst, ì300mm Wafer-Scale Integrated Processing Capability for Research and Development on Novel Materials and Device Conceptsî, GOMACTECH (2010)

C. L. Borst, S. G. Bennett, Z. R. Robinson, D. R. Steinke, S. A. McTaggart, J. G. Ryan, J-U. Lee, "Oxide / Polysilicon CMP Process Integration for Novel Graphene and Carbon Nanotube Devices", Proc. 13th CMP-MIC Conference, 295 (2008) 

X. Miao, L. Huli, H. Chen, X. Xu, H. Woo, C. Bencher, J. Shu, C. Ngai, C. Borst, "Double Patterning Combined with Shrink Technique to Extend ArF Lithography for Contact Holes to 22nm Node and Beyond", Proc. SPIE 6924, 69240A (2008)
 
C. L. Borst, I. Ul-hasan, R. E. Geer "Investigations of Nanoparticle Abrasive Retention in Polyurethane CMP Pads post- Cu CMP"
 3rd Meeting of the Levitronix CMP User's Group, San Francisco, CA (2007)
 
P. Chidambaram, C. Borst, T. Tugbawa, H. Chen, S. Sherrof, B. Lee, D. White, T. Smith, and G. Shinn "Evaluation of Dummy Metal Design by Electro-chemical Copper Deposition (ECD) and Chemical Mechanical Polishing (CMP) Modeling" IEEE International Electron Devices Meeting, San Francisco, CA, December (2004)
 
R. J. Gutmann, C. L. Borst, and W. N. Gill Invited Presentation: "CMP of Low Dielectric Constant Polymers and Organosilicate Glasses - Fundamental Mechanisms and Copper Damascene Implications" 204th Meeting of the Electrochemical Society, Orlando, FL, Abs 901 October (2003) T. Park,
 
T. Tugbawa, D. Boning, C. Borst, G. Shinn, and P. Chidambaram "Instantaneous Removal Rate in Copper CMP" Proc. CMP Users Group Meeting, San Jose CA, (2001)
 
C. L. Borst, D. G. Thakurta, W. N. Gill, and R. J. Gutmann Invited Paper: "Chemical-Mechanical Planarization of low-k Polymers for Advanced IC Structures" Polymer Material Workshop, London, England, December (2000)
 
R. J. Gutmann, C. L. Borst, B.-C. Lee, D. G. Thakurta, D. J. Duquette, and W. N. Gill Invited Paper: "Chemical-Mechanical Polishing of Copper and SiLK in Model Alumina Slurries: Experimental and Modeling Results" 17th VMIC Conference, Santa Clara, CA, June 26-30, 123 (2000)
 
C. L. Borst, R. J. Gutmann, and W. N. Gill, "Mechanisms for Chemical-Mechanical Planarization of Low Dielectric Constant Polymers in Copper Slurries" 16th VMIC Conference, Santa Clara, CA, September 7-9, 207 (1999)
 
C. L. Borst, W. N. Gill, and R. J. Gutmann, "Chemical-Mechanical Planarization of BCB and SiLK Low-k Polymer Interlevel Dielectrics in Copper Slurries" 4th VMIC CMP-MIC Conference, Santa Clara, CA, February, 409 (1999)
 
C. L. Borst, Y. Xiao, R. J. Gutmann, and W. N. Gill, "CMP of Polymers in Copper Slurries: Future Needs and Present Understanding" Clarkson CMP Conference, Lake Placid, NY, August (1999)
 
C. L. Borst, R. J. Gutmann, and W. N. Gill, "CMP of Organic Low-k Dielectrics: Chemical Alteration and Effect on Removal Rate" SRC Graduate Fellowship Annual Conference, Austin, TX, September 13-14 (1999)