Professional Background

Process Development Engineer (FEOL), College of Nanoscale Science and Engineering (2010-present)

• Process Engineer, IBM Microelectronics (2002-2010)
• Quality Engineer, IBM MLC (2000-2002)

Work Experience

• FEOL and BEOL insulator process ownership and R&D
• Epitaxial film process ownership
• Laser annealing for S/D activation and silicidation
• ALD and High-K process ownership in development
• Vertical furnace and RTP process ownership in manufacturing

Education

• Master of Science, Ceramic Engineering and Materials Science, Alfred University, Alfred, NY 2000
• Bachelor of Science, Ceramic Engineering and Materials Science, Alfred University, Alfred, NY 1998

Responsibilities

Mr. Herman is responsible for providing unique high temperature, implantation, and thin film solutions to CNSE’s partners and internal team. These solutions are used to advance integration and process capabilities. Mr. Herman works with Ion implantation and High Temperature anneal vendors to help evaluate new tooling capabilities using CNSE integrated devices. He also works to provide thin film, junction activation, and salicidation processes for CMOS and Fin-FET technologies.