Wenli Z. Collison

Wenli Z. Collison

Wenli Z. Collison
Reactive Ion Etch Process and Equipment Engineer



Professional Background

  • RIE Process Engineer/Equipment Engineer:  CSR/Photonics/META,  Albany, NY. 2019-present
  • RIE/PVD/PECVD/ECD Process and Equipment Owner:   PEMC, Albany, NY. 2017-2018
  • RIE Process Engineer:  G450C, Albany, NY. 2012-2016
  • Staff Process Engineer :  Lam Research,  Albany, NY. 2010-2012
  • Consultant:  Intevac  Inc., Santa Clara, CA. 2006-2010
  • Staff /Senior /Process Engineer III:  Lam Research.  Fremont, CA. 1995-2004
  • Postdoctoral Researcher :  Univ. of Illinois,  Urbana-Champaign,  IL. 1994-1995


  • 1994 Ph.D. (Plasma Physics), Univ. of California, San Diego
  • 1991 M.S. (Physics), Univ. of California, San Diego 
  • 1989 B.S. (Solid State Physics), Univ. of Science and Technology of China


As an etch engineer in the CSR etch team, Wenli is currently responsible for etch process development for various projects including photonics and META project.  She is also equipment engineer in charge of multiple etch tool installations in Applied Materials’ META project.

Issued Patents: 12 issued patents

Vacuum plasma processor having a chamber with electrodes and a coil for plasma excitation and method of operating same Patent No. 8,114,246 Issue date: Feb. 2012

Inductively coupled plasma downstream strip module Patent No. 6,692,649 Issue date: Feb. 2004

Plasma processor with coil having variable rf coupling Patent No. 6,229,264 Issue date: May 2001

Processing chamber with optical window cleaned using process gas Patent No. 6,052,176 Issue date: April 2000

Publications and Conferences

450mm Etch Process Development and Process Chamber Evaluation Using 193i DSA Guided Pattern ,  SPIE    Jan. 2016     Wenli Collison, Yii-Cheng Lin, Shannon Dunn, Hiroaki Takikawa, James Paris, Lucy Chen, Troy Detrick, Jun Belen, George Stojakovic, Michael Goss, Norman Fish, Minjoon Park, Chih-Ming Sun, Mark Kelling, Pinyen Lin

Studies of the Low-pressure Inductively-coupled Plasma Etching for a Larger Area Wafer Using Plasma Modeling and Langmuir Probe    JVST A    Jan. 1998       Wenli Collison,  Tom Ni and Michael Barnes

A 3-D Model for Inductively-coupled Plasma Etch Reactors        Invited Talk    AVS New Mexico Chapter Annual Meeting  1997     Mark Kushner, Wenli Collison, Michael Grapperhaus, John Holland and Michael Barnes





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