Professional Background

• Photonics Integration Engineer, CNSE- Albany, NY (2016- present)
• Research Associate, RPI, Troy, NY (2012-2016)

Education

• PhD, Physics, University of Idaho, Moscow, Idaho
• MS, Physics, University of Idaho, Moscow, Idaho
• BS, Physics, Tribhuvan University, Kathmandu, Nepal

Awards

The Outstanding Graduate Student Award “Diane A. Haynes Memorial Award”, University of Idaho, 2012

Responsibilities

As a photonics integration engineer, Dr. Timalsina is responsible for:

• Wafer delivery and lot ownership for customer commitments including route building, wafer inspections, and meeting all shippable deadlines and commitments
• Process requirements and specifications, ground rule manual input
• Input on device design for manufacturability and process sensitivities
• Test-site assembly, coordination with designers and mask house on .gds input

Selected Publications

• Yukta P. Timalsina, Andrew Horning, Robert F. Spivey, Kim M. Lewis, Tung-Sheng Kuan, Gwo-Ching Wang, and Toh-Ming Lu. Effects of nanoscale surface roughness on the resistivity of ultrathin epitaxial copper films, Nanotechnology 26 075704 (2015)
• Yukta P. Timalsina, Xiaohan Shen, Zhengping Fu, Masashi Yamaguchi, Gwo-Ching Wang, Kim Lewis, and Toh-Ming Lu. Evidence of enhanced electron-phonon coupling in ultrathin epitaxial copper films, Appl. Phys. Lett. 103, 191602 (2013)
• L. Chen, L. Andrea, Y.P. Timalsina, G.-C. Wang and T.-M. Lu. Engineering single crystal porous metal films using dynamic oblique angle deposition, Cryst. Growth Des. 13, 2075 (2013)
• Y.P. Timalsina, D. Oriero, T. Cantrell, T. Prakash, J. Branen, D. E. Aston, K. Noren, J. J. Nagler, S. Rastogi, D. N. McIlroy, and G. Corti. Characterization of a vertically aligned silica nanospring-based sensor by alternating current impedance spectroscopy, J. Micromech. Microeng. 20, 095005 (2010)