Please join the Mechanical Engineering Department for a seminar delivered by Candidate, Dr. Leila Choobineh on Tuesday, June 2nd, 1pm-2pm in Donovan 1193. Please review her abstract and biography below:

                     Analytical and Experimental Investigation of Thermal Transport in

                                      Three-Dimensional Integrated Circuits (3D ICs)

                                                          Leila Choobineh

Mechanical and Aerospace Engineering Department

The University of Texas at Arlington, Arlington, TX 76019

Email: choobineh.leila@mavs.uta.edu; Ph: 817-272-9338;

Abstract

Thermal management of three-dimensional integrated circuits (3D ICs) is recognized to be one of the foremost technological and research challenges currently blocking the widespread adoption of this promising technology. The computation of steady-state temperature fields in a 3D IC is critical for determining the thermal characteristics of a 3D IC and for evaluating any candidate thermal management technology. Experimental measurements help validate thermal models for predicting the temperature field in a 3D IC and determine key physical parameters.

In this talk, experimental results of thermal performance of a two-die 3D IC will be presented and a model for measuring interdie thermal resistance will be introduced. An analytical heat transfer model for computing three-dimensional temperature fields in a 3D IC will be described.

Biography

Leila Choobineh is an adjunct faculty in the Mechanical and Aerospace Engineering Department at the University of Texas at Arlington, where she did research at the Microscale Thermophysics Laboratory. She received her Ph.D. (2014) from University of Texas at Arlington and M.S. (2008) in Mechanical Engineering from Shahrekord University (Iran), and her B.Sc. (2005) in Mechanical Engineering from Shiraz University (Iran) with top honors. Her research interests include thermal characterization of 3D integrated circuits, flexible electronics, thermal management of microelectronics, 2D materials and microelectronics cooling.