[caption id="" align="alignnone" width="675"] A wafer made up of seven-nanometer chips. IBM said it made the advance by using silicon-germanium instead of pure silicon. Credit Darryl Bautista/IBM[/caption]

IBM said on Thursday that it had made working versions of ultradense computer chips, with roughly four times the capacity of today’s most powerful chips.

The announcement, made on behalf of an international consortium led by IBM, the giant computer company, is part of an effort to manufacture the most advanced computer chips in New York’s Hudson Valley, where IBM is investing $3 billion in a private-public partnership with New York State, GlobalFoundries, Samsung and equipment vendors.

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John Markoff | July 9, 2015