SUNY Poly’s IC Fabrication Class Continues to See Heavy Interest from Industry Partners, Students

SUNY Poly’s IC Fabrication Class Continues to See Heavy Interest from Industry Partners, Students

Published:
Wednesday, September 26, 2018 - 12:14
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300 mm wafer

SUNY Polytechnic Institute’s (SUNY Poly) two-day Integrated Circuit (IC) Fabrication Class, presented by Ernest Levine, formerly a Yield Control Engineer at IBM for 25 years and now Professor of Nanoscience at the institution, continues to see strong attendance. The course is expected to receive a maximum level interest from around 60 people who have already signed up to take part in the next engagement, scheduled for October 15 and 16, 2018. The attendees come from a wide range of the nanotechnology-focused community, and include everyone from high-tech investors to analog and digital fab workers and support vendors, as well as members of the military. Nearly one dozen SUNY Poly graduate students also plan to attend the course as a refresher and a chance to meet the attendees at lunch for networking purposes.

Because the IC Fabrication Class books up quickly, all interested attendees are advised to visit https://www.sunypoly.edu/events/ic-fabrication.html where information will be posted about the next two-day course, which is expected to take April 8 and 9, 2019.

The IC Fabrication course is an all-inclusive look at the procedures, tools, detailed building methods, and background materials in order to understand where the computer chip industry is today and where it is going in the next 6 years or so.

The first day of the class introduces the IC Fab, how it operates, and explains concepts such as test structures, doping, the FET transistor, the PN junction, as well as concerns about power and gate leakage driving current build strategies. Attendees also learn about Moore’s law and techniques to increase the speed and density of devices such as through strain engineering and double patterning. Details of the tri-gate chip build and Ultimate-Thinning-and-Transfer-Bonding (UTTB) are included, as well as high-K metal gates. The last half of the second day includes topics such as 5 nm node nanosheets, air gap, among other specialized topics related to chip build.

Integrated into the presentations are step-by-step illustrated builds of all aspects of the current processes, along with discussion of defects and the attempts to control them to maximize chip yield. This discussion also includes details of the damascene process and its associated defects.

When completed, those taking the course are able to understand the IC fabrication process in addition to being able to talk about IC fabrication with anyone in the field.
 

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About SUNY Polytechnic Institute (SUNY Poly)

SUNY Poly is New York’s globally recognized, high-tech educational ecosystem. SUNY Poly offers undergraduate and graduate degrees in the emerging disciplines of nanoscience and nanoengineering, as well as cutting-edge nanobioscience and nanoeconomics programs at its Albany campus, and undergraduate and graduate degrees in technology, including engineering, cybersecurity, computer science, and the engineering technologies; professional studies, including business, communication, and nursing; and arts and sciences, including natural sciences, mathematics, humanities, and social sciences at its Utica/Rome campus; thriving athletic, recreational, and cultural programs, events, and activities complement the campus experience. As the world’s most advanced, university-driven research enterprise, SUNY Poly boasts billions of dollars in high-tech investments and hundreds of corporate partners since its inception. For information visit www.sunypoly.edu.