Akrion Systems News Release: Akrion Systems Improves Process
Capabilities on 450mm Wafers

Akrion Systems News Release: Akrion Systems Improves Process
Capabilities on 450mm Wafers

Wednesday, October 19, 2016 - 09:44
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Akrion Systems

Allentown, Pa., October 18, 2016 - Demonstrating significant progress in the development of next-generation technologies for the industry transition to computer chip production using 450mm wafers, Akrion Systems, in partnership with SUNY Polytechnic Institute (SUNY Poly), and the Global 450mm Consortium (G450C), today announced a batch process for 450mm wafers in which silicon nitride can be selectively removed. This new process is enabled via the use of specially built “tanks” which allows specific films to be etched on up to five 450mm wafers at a time to more efficiently create the nanoscale infrastructure needed to manufacture computer chips on the larger sized silicon substrate.

Over Akrion Systems’ long history, it has provided equipment to the five member companies of the consortium: Intel, TSMC, GLOBALFOUNDRIES, IBM, and Samsung. During the past few years, Akrion Systems has developed prototype equipment for both single wafer and batch immersion applications and is currently providing the needed process solution for the consortium.

Akrion Systems President and Chief Executive Officer Michael Ioannou said, “With industry interest in expanding semiconductor wafer sizes from 300 to 450mm to improve efficiencies for enhanced productivity, we are pleased to be able to play a small part in this important endeavor, showcasing our technological development capabilities in the process.”

Akrion Systems Vice President for Applications and Technology Dr. Ismail Kashkoush said, “Akrion Systems has always valued research and development work to expand our capabilities and provide our customers with the best possible equipment to give them competitive advantages. The task to provide equipment for the future 450 mm wafer size was a difficult challenge, but it is one in which we were proud to not only meet, but also exceed expectations.”

Engineering Director of CMP / Thermal / Cleans for G450C, Daniel França, said, “Akrion Systems has successfully demonstrated a batch selective silicon nitride removal process at 450mm. By meeting the process targets in the equipment performance metric (EPM), defined by the consortium, and by making this process capability available, it moves the G450C a step closer to providing front end of line (FEOL) test structures for advanced module development, further expanding the consortium’s technological resources and abilities.”

About Akrion Systems Akrion Systems provides advanced surface preparation process solutions and systems, including single-­wafer and batch-­immersion cleaning tools for the microelectronic, photovoltaic and display industries. Akrion Systems’ customers produce a diverse range of products, including solar cells, integrated circuits for DRAM, Flash, Logic and MEMS as well as new and reclaimed semiconductor wafers, flat panel displays, and photomasks. The company’s headquarters in Allentown, Pennsylvania includes a class­1 clean room for process development and an ISO 9001:2000 compliant production facility. For more information, contact Joseph McManus, Vice President, Sales and Marketing, 1-610-530-3471, jmcmanus@akrionsystems.com

About G450CThe G450C is focused on building the 450mm wafer and equipment development environment. The vision of the G450C is to be a public-private partnership program (New York State (SUNY Poly), Intel, TSMC, Samsung, IBM and GLOBALFOUNDRIES) that develops cost-effective test wafer fabrication infrastructure, equipment prototypes and high-volume tools to enable a coordinated industry transition to 450mm wafers. The program will use the capabilities established at SUNY Poly for joint development activities and support of a comprehensive industry ecosystem. For information, visit www.g450c.org.

About SUNY Polytechnic Institute SUNY Polytechnic Institute (SUNY Poly) is New York’s globally recognized, high-tech educational ecosystem, formed from the merger of the SUNY College of Nanoscale Science and Engineering and SUNY Institute of Technology. SUNY Poly offers undergraduate and graduate degrees in the emerging disciplines of nanoscience and nanoengineering, as well as cutting-edge nanobioscience and nanoeconomics programs at its Albany location and undergraduate and graduate degrees in technology, including engineering, cybersecurity, computer science, and the engineering technologies; professional studies, including business, communication, and nursing; and arts and sciences, including natural sciences, mathematics, humanities, and social sciences at its Utica/Rome location. Thriving athletic, recreational, and cultural programs, events, and activities complement the campus experience. As the world’s most advanced, university-driven research enterprise, SUNY Poly boasts more than $43 billion in high-tech investments and over 300 corporate partners. For information visit www.sunycnse.com and www.sunypoly.edu.

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