CMP Processes

  • FEOL Applications
    • STI
      • Our POR STI process has two steps. The first is a bulk oxide removal using silica slurry which is endpointed; resulting in a repeatable active oxide thickness going into the second step. The second step uses fixed abrasive to meet the rigorous dishing requirements for advanced node STI step heights.
    • Oxide
    • Poly
  • BEOL Applications
    • Cu / liner
    • PMD / IMD
  • Advanced Applications
    • TiN
    • Poly for FINFET
    • Poly-Open-Polish for Replacement Gate

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