Capability description

• Power packaging design from a holistic electro-physical perspective, using:
  • 3D CAD modelling
  • Multi-physics simulation (electrical, thermal, mechanical)
  • Electrical parasitic extraction
  • Iterative SPICE modelling
• Design for manufacturing to enable outsourcing of part fabrication and advanced packaging processes

Service

• Static and dynamic characterization of WBG power semiconductor device within discrete power package
  • Double-pulse and Buck converter –based testbeds for high voltage and high temperature performance evaluation

Discrete high voltage package designed at SUNY Poly and packaged at Quik-Pak (Escondido, CA)	Open cavity TO-247 package for low voltage (1.2kV) SiC MOSFETs